Monday, September 15, 2014

Study in IITs and NITs to get a good job in Semiconductor Industry?



Some days ago I was searching for some good content on current market status of semiconductor industry. There I found something interesting about the semiconductor/VLSI companies recruitment policies, most of them are focused on the individual technical skill not on the education background. It is true in some of the cases like if you search job advertisement of some of the SMEs they usually gives preference to IIT/NITs students whereas the  companies like Silab Tech , Spontey, Smart play, Cadence etc. they gives chance to work other Indian university  students also.

Semiconductors

Therefore to get a entry level job in a semiconductor industry is not only in the favour of IIT/NITs everyone who so ever have talent to crack the problems, interest in VLSI and Semiconductor area can get a job in Semiconductor and VLSI industry.

There are a number of startup companies in this domain which are providing good chances to real talent. Some of them are Masamb electronics systems, RF silicon, Silicon Mentor; Pass Semiconductor, Zepto Chip, GDA technologies etc. 

Tags :    Silicon Mentor       Zepto Chip      Silab tech        Spontey         GDA Technologies

                                                                                                              
Author - Dinesh Chauhan
(Design Engineer at Silicon Mentor)

Thursday, September 4, 2014

Role of Built-In Self-Test [BIST] in Fault detection

We can easily feel the rapid change in the technology day by day. As we all trying to digitalize everything to make our life much and more simpler. Various developing companies are trying their best to develop user friendly gazettes that must be so small as well as cost efficient that can be easily come under the common man reach. Developers are trying to put lots n lots of components on small integrated chip. Hence, Developers had introduced a concept of ‘Built-in Self-Test’, to test the proper functioning of these chips components. So that, finally when that IC comes in the hand of common man in form of gazette, he can make its uninterrupted use.

Basically, concept of Built-In Self-Test came into picture, when an idea of not using an external circuitry just for testing the proper functioning of all IC components strikes in developers mind. According to this concept, any external circuit is not needed to test the IC. We use to develop an algorithm in such a manner, that will itself check the outputs of a test pattern generator, with this idea, that on applying that TPG output as an input of any circuit under test, we’ll get the desired result or not. BIST is not limited up to this only but also capable of finding our design’s efficiency, in terms of fault coverage, that how much number of faults our design has detected. Fault refers to those inputs, on which our CUT doesn’t give desired output.

It’s very simple approach of BIST, Design for test is developed in which, a comparator used to detect the fault, by comparing the patterns of faulty CUT with non faulty or reference CUT. In this sequence, a slight change is done in the functionality of CUT. Then, finally comparator used to match each bits of both reference circuit and faulty CUT. Previously knowing the total number of faults, this DUT can easily find out the fault finding efficiency of whole design. 

Basic Architecture of BIST
                                                                               
                                                                                

                                                                                                              Author - Akash Kumar
(Research Associate at Silicon Mentor)

Monday, September 1, 2014

How to detect and correct faults in NOC ?

The use of system on chip (SOC) has increased exponentially due to high integration of a number of IP on a single chip. The higher number of IP needs higher number of bus based interconnections. The bus based interconnection leads to a parallel communication which is not efficient for bandwidth, latency and power consumption. To solve this problem a switching network is used, called Network On Chip(NOC). The complexity and the technology scale increase the occurrence of intermittent and transient faults.

In order to run a fault-tolerant system smoothly the first thing to be done is to detect the location of the faults. The fault detection mechanism should also be able to distinguish transient faults from permanent faults. In order to detect transient link errors the methods used are error coding techniques viz. cyclic redundancy check (CRC) and parity codes. To detect permanent errors in NoC there is an in-line test method to test each adjacent pair of wires and a syndrome storing-based error detection method based on evaluation of consecutive code syndromes at the receiver and there are also few works focusing on detecting transient faults and permanent faults at the meantime.

There are mainly three techniques to handle transient faults in NoC and they are Automatic repeat request (ARQ), Forward error correction (FEC), and Hybrid ARQ (HARQ). Also transient faults can be handled at both link-level and transport level. In ARQ-based error control, it is found to have errors the packet is retransmitted. They are retransmitted until it is received error free packet. The error detection is usually implemented through a cyclic redundancy check (CRC). For a simple error detecting, the code is applied to the packet before transmitting, and at the receiver side a checksum will be calculated to ensure that no error has occurred. The packet is retransmitted, if the checksum does not add up to the right value.

·         114 bits, contains a 34 bits head and an 80 bits payload. A valid bit (V) is used to mark a packet valid or not. Relative addressing is used for the source and destination address fields (SA and DA) which are 12 bits respectively. The HC field (9 bits) records the number of hops the packet has been routed.
·         No. of input should be equal to the no. of output.
A 2-hop fault information transmission mechanism isused to reduce the average hop counts. In the 2-hop fault information transmission mechanism, four additional signals (fault from[d] (1 bit), fault to[d] (1 bit), FoN from[d] (3bits), FoN to[d] (3 bits)), which are 8 bits in total for each direction of a switch and they are used to transmit fault information. Each switch is not only responsible for transmitting its own link status to four neighbours but also collecting the link status from its three neighbours and transmitting to the fourth neighbour. For example, switch A can get the status of 16 links within 2 hops. 




  Fault information transmission mechanism
The signal FoN to[d] collected by the current switch is a 3-bit vector to denote link status along the other three directions except d and is transmitted to the neighbour along d.

Tags :    HDL                 FPGA                    ASIC                   HSPICE                 VHDL 



                                                                                                         Author- Dharmendra Kumar
(Research Associate at Silicon Mentor)