PROCESS
CORNERS
Process corners refer to the process inaccuracies,
temperature and other parameter variations. The simulations that are used to analyze
these process inaccuracies are different from each other. The corners describe the
differences of a chip behavior form its nominal condition are usually supplied
with the process kit and these are originally located in model libraries.
These kit
contains corner condition for the SS,
FF, TT, FS, SF etc process, where these abbreviations stands for Slow NMOS-Slow
PMOS, Fast NMOS-Fast PMOS, Typical NMOS-Typical PMOS, Fast NMOS-Slow PMOS, Slow
NMOS-Fast PMOS etc. These corner conditions are checked with the help of EDA or
simulation process and in result it describes IC behavior. It may contain the
process of temperature variation and Vdd (supply voltage) variation
depends on customer IC requirement. e.g. For car manufacturing company the IC
should be checked for maximum corner
conditions and temperature variations otherwise
IC will not fulfill all requirement.
mtech. vlsi
projects, mtech
projects for ece, mtech
projects, mtech. paper
publication, m.tech
research projects, m.tech
ieee projects